Updated July 05, 2011
For our list of Solar Cell and Module Manufacturing equipment, please see list below.
| ID | Description | Qty. |
| 48 | BALDOR JIB CRANE & AIR LIFT (1999) Used to lift and transport the wafer carriers between the Ultrasonic clean tanks | 1 |
| 49 | AUTOMATION TECHNOLOGY INC., WICS-500 AUTO BOATER/WAFER BOATER (2004) , WAFER INSPECTION AND AUTO BINING TO CASSETTES, combines automated wafer cassetting with integrated laser measurement and high speed digital imagining technology to provide 100%, in process, wafer inspection. Solar wafer stacks are singulated and the individual wafers are cassetted at a process rate of 800-1000 wafers per hour. During the automatic cassetting process, three non-contact laser measurement systems collect thickness data, while high speed digital imagining analysis is used for defect detection on every wafer. Wafers which exceed allowable thickness variation parameters or exhibit defects such as chipped and broken wafers are rejected, while wafers that pass the test criteria automatically continue into storage cassettes. Selected data, such as Average Thickness, Total Thickness Variation (TTV), and total numbers of a defect type, for each run is displayed on the operator interface screen. This system includes data download capability to a host system for process control and process improvement feedback. Preloaded wafer magazines are quickly and easily changed at the end of each production run. Full cassettes are automatically exchanged with empty cassettes via a cassette transfer and management sub-system. |
1 |
| 50 | NAPCO RTMH-G3291 WESTLINE ETCHER S/N 2005 (2003) Automated industrial wet cleaning and etching system with very high through-put carousel type over-head transport system. System is 18' wide X 44' long X 11' high. Current application: cleaning, etching, rinsing, and drying of large batches of 6 inch silicon wafers. 32 carrier arms, each arm supports one large basket that holds 8 cassettes of 25, 6inch wafers. Current through-put recipe allows for 3,600 wafers per hour of production. PLC controls, automatic or manual chemical make up and replenishment. All the wet processing tanks are poly-propylene and of varing sizes and function. Current tank stations and process flow: manual load of wafer cassettes into carrier basket. Step 1: detergent clean, 3 stations, approx. 300 gallon capacity, dimensions, 72" long, 43" wide, 27" deep. Step 2: cascading DI rinse, 4 stations, approx. 350 gallon capacity, dimensions, 93" long, 39" wide, 27" deep. Step 3: heated etch, 175°F, 1 station, approx. 75 gallon capacity, dimensions, 21" long, 43" wide, 24" deep. Step 4: Hot DI rinse, 120°F, 1 station, approx. 75 gallons, dimensions, 21" long, 39" wide, 24" deep. Step 5: heated etch, 175°F, 3 stations, approx. 250 gallons, dimensions, 69" long, 43" wide, 24" deep. Step 6: heated etch, 175°F, 3 stations, approx. 230 gallons, dimensions, 72" long, 39" wide, 24" deep. Step 7: Warm cascading DI rinse, 120°F, 1 station, approx. 100 gallons, dimensions, 27" long, 43" wide, 24" deep. Step 8: Warm cascading DI rinse, 120°F, 3 stations, approx. 230 gallons, dimensions, 72"long, 39" wide, 24" deep. Step 9: Heated neutralization, 120°F, 3 stations, approx. 250 gallons, dimensions, 69" long, 43"wide, 24" deep. Step 10: Warm cascading DI rinse, 100-180°F, 5 stations, approx. 375 gallons, dimensions, 117" long, 39" wide, 24" deep. Step 11: Heated Drier box, 180°F, S.S. construction, 3 stations, 66" long, 43" wide, 24" deep. Utilizes operator load and unload of process carriers. 35 carriers included. Control systems included. Spare parts available in lots 227-291. | 1 |
| 60 | POLY-FLOW ENGINEERING S-417 TUBE WASHER, S/N 15478, Verticle quartz tube etcher/rinser. Dual compartments. 140" high, 63" wide, 48" deep. HF chemical make up tank, pump system, 36" high, 62" wide, 46" deep. | 1 |
| 61 | TAS SYNERGISTICS 1346 UTILITY WET SINK, S/N MTS-1-1-198X36 (2003) Quartz tubes and parts rinse sink, heated DI wafer system (ICD HeatFlex). O.D. 90" high, 96" wide, 36" deep. Tank dims.: 72" long, 20" deep, 23" wide. | 1 |
| 79 | DEMAG-EDKE 1-TON OVRHEAD GANTRY CRANE, S/N 95-139, (2005) W/TRACK-Currently installed over the banks of pumps for the LPCVD furnaces. Used to move pumps in and out for maintenance. | 1 |
| 80 | FAITH ENTERPRISES - 435125 WAFER TRANSFER SYSTEM, RAPITRAN II, SOLAR CELL BATCH TRANSFER, This machine transfers 25 wafers from a cassette to a diffusion boat and back again. Multiple transfer modes cassette to cassette and boat to boat transfers. | 12 |
| 147 | MERCURY CELL LINE (2001) front side metal paste print and cure, load and unload stations. RTS Wright load and unload stations, ADEPT Technology robotics, AMI carousel metal paste print station, RTC mid-temp drier furnace | 1 |
| 147B | MERCURY CELL LINE (2001) back side metal paste print and cure, load and unload stations. RTS Wright load and unload stations, ADEPT Technology robotics, AMI carousel metal paste print station, RTC mid/high-temp drier/firing furnace | 1 |
| 149 | GEMINI UNLOAD STATION (2000), Adept robotics with twin pick and place heads,dual CCD conveyor monitoring cameras, third CCD overview camera | 1 |
| 150 | GEMINI UNLOAD STATION (2000), Adept robotics with twin pick and place heads,dual CCD conveyor monitoring cameras, third CCD overview camera | 1 |
| 157 | TAS BORON GLASS REMOVAL, S/N 1342 (LOCATION OREGON), (2003) Automated multi-station etch and rinse sink for large batch etching-cleaning of silicon wafers | 1 |
| 162 | INDUSTRIAL AIR SOLUTIONS, INDUSTRIAL VACUUM SYSTEM | 1 |
| 163 | RAM FLAT 55ER WASTE MATERIAL COMPACTOR, S/N 55897 (1999), Hydraulic ram compactor of non-toxic materials | 1 |